The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Oct. 29, 2009
Alexander May, Seeheim-Jugenheim, DE;
Martin Koestner, Darmstadt, DE;
Joerg Becker, Darmstadt, DE;
Joerg Schallenberg, Karlstein, DE;
Hermann Siegert, Seeheim-Jugenheim, DE;
Bernd Vogel, Wiesbaden, DE;
Alexander May, Seeheim-Jugenheim, DE;
Martin Koestner, Darmstadt, DE;
Joerg Becker, Darmstadt, DE;
Joerg Schallenberg, Karlstein, DE;
Hermann Siegert, Seeheim-Jugenheim, DE;
Bernd Vogel, Wiesbaden, DE;
Evonik Roehm GmbH, Darmstadt, DE;
Abstract
The invention relates to a method for producing a carboxylic acid amide from a carbonyl compound and hydrocyanic acid, comprising the steps of A) reacting a carbonyl compound with hydrocyanic acid to produce a hydroxycarboxylic acid nitrile, B) hydrolysis of the hydroxycarboxylic acid nitrile obtained in step A) in the presence of a catalyst comprising manganese dioxide, wherein a molar excess of carbonyl compound is used in relation to the hydrocyanic acid to react the carbonyl compound with hydrocyanic acid according to step A), and the reaction mixture obtained in step A) is not purified by distillation before the hydrolysis according to step B) is carried out. The invention furthermore relates to a method for producing alkyl(meth)acrylates from polymers, moulding compounds and moulded bodies, wherein a method for producing a carboxylic acid amide from a carbonyl compound and hydrocyanic acid is carried out in accordance with the method described above.