The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Sep. 23, 2011
Werner Hoess, Shanghai, CN;
Michael Wicker, Seeheim-Jugenheim, DE;
Klaus Schultes, Wiesbaden, DE;
Klaus Albrecht, Mainz, DE;
Martin Mohrmann, Weiterstadt, DE;
Werner Hoess, Shanghai, CN;
Michael Wicker, Seeheim-Jugenheim, DE;
Klaus Schultes, Wiesbaden, DE;
Klaus Albrecht, Mainz, DE;
Martin Mohrmann, Weiterstadt, DE;
Evonik Röhm GmbH, Darmstadt, DE;
Abstract
A molding compound comprises a copolymer (I)a), produced by polymerization of 90-100% by weight methylmethacrylate, styrene and malic acid anhydride, and optionally 0-10% by weight additional monomers which can be copolymerized with methylmethacrylate, a (co)polymer (II)b), produced by polymerization of 80-100% by weight methylmethacrylate and optionally 0-20% by weight additional monomers which can be copolymerized with methylmethacrylate, and has a solution viscosity in chloroform at 25° C. (ISO 1628 Part 6) of 50 to 55 ml/g, as well as c) optional conventional additives, auxiliary agents and/or fillers. The molding compound is characterized in that the copolymer (I) has a solution viscosity in chloroform at 25° C. (ISO 1628 Part) of 55 ml/g or less. Also disclosed are moldings produced by thermoplastic processing of the molding compound and their uses.