The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Mar. 12, 2014
Applicant:
Materion Corporation, Mayfield Heights, OH (US);
Inventor:
Ramesh Kothandapani, Singapore, SG;
Assignee:
Materion Corporation, Mayfield Heights, OH (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 24/03 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/2746 (2013.01); H01L 2224/27334 (2013.01); H01L 24/83 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/1033 (2013.01); H01L 2224/2711 (2013.01);
Abstract
The amount of gold required for bonding a semiconductor die to an electronic package is reduced by using a sheet preform tack welded to the package prior to mounting the die. The preform, only slightly larger than a semiconductor die to be attached to the package, is placed in the die bond location and tack welded to the package at two spaced locations.