The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Aug. 30, 2013
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventor:

Eiji Takano, Oita, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/762 (2006.01); H01L 21/683 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76251 (2013.01); H01L 21/6836 (2013.01); H01L 21/6835 (2013.01); H01L 21/2007 (2013.01); H01L 2221/68327 (2013.01);
Abstract

According to one embodiment, a first adhesive layer is formed on one major surface of a first substrate. The first substrate and a second substrate are adhered using a second adhesive layer that has thermosetting properties and covers the first adhesive layer, wherein a bonding strength between the second substrate is greater than a bonding strength between the second substrate and the first adhesive layer. The other major surface of the first substrate is polished, and the first substrate is thinned. A physical force is then applied to peripheral parts of the second adhesive layer, and a circular notched part is formed along the outer perimeter of the second adhesive layer to separate the first substrate and the second substrate at the interface between the first adhesive layer and the second adhesive layer.


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