The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Apr. 13, 2011
Applicants:

Julian Gonska, Reutlingen, DE;

Jens Frey, Filderstadt, DE;

Heribert Weber, Nuertingen, DE;

Eckhard Graf, Gomaringen, DE;

Roman Schlosser, Waldkirch, DE;

Inventors:

Julian Gonska, Reutlingen, DE;

Jens Frey, Filderstadt, DE;

Heribert Weber, Nuertingen, DE;

Eckhard Graf, Gomaringen, DE;

Roman Schlosser, Waldkirch, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); H01L 23/48 (2006.01); B81C 1/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); B81C 1/00095 (2013.01); H01L 21/76837 (2013.01); B81B 2203/033 (2013.01); B81B 2207/095 (2013.01); H01L 2224/48463 (2013.01);
Abstract

An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.


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