The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Jun. 26, 2014
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Yasunari Ooyabu, Osaka, JP;
Kazuhiro Fuke, Osaka, JP;
Daisuke Tsukahara, Osaka, JP;
Takashi Kondo, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/52 (2010.01); F21V 21/00 (2006.01); H01L 33/46 (2010.01); H05K 13/00 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); F21V 21/00 (2013.01); H01L 33/46 (2013.01); H05K 13/00 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract
An element-connecting board is a lead frame for allowing a light emitting diode element to be connected to one side thereof in a thickness direction. The element-connecting board includes the lead frame which is provided with a plurality of leads disposed with spaces from each other and a first insulating resin portion which is light reflective and fills the spaces.