The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Dec. 20, 2009
Reid Brennen, San Francisco, CA (US);
Kevin Killeen, Woodside, CA (US);
Karen L. Seaward, Palo Alto, CA (US);
Reid Brennen, San Francisco, CA (US);
Kevin Killeen, Woodside, CA (US);
Karen L. Seaward, Palo Alto, CA (US);
Agilent Technologies, Inc., Santa Clara, CA (US);
Abstract
A method for solid state bonding of a plurality of metallic layers and devices made by that method are disclosed. First and second metallic layers are solid state bonded utilizing a protective coating on the non-bonded surfaces that engage the pressure applying appliance to prevent the surfaces from adhering to the pressure applying appliance and to protect the surfaces from imprinting during the bonding process. The invention can be used to fabricate micro-channel devices with smooth outer surfaces and eliminate mold release compounds utilized in conventional bonding procedures.