The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Oct. 01, 2010
Applicants:
Teppei Miura, Toyohashi, JP;
Manabu Kaneko, Toyohashi, JP;
Inventors:
Teppei Miura, Toyohashi, JP;
Manabu Kaneko, Toyohashi, JP;
Assignee:
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/02 (2006.01); C08J 5/24 (2006.01); C08G 59/32 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); C08G 59/3218 (2013.01); C08G 59/3227 (2013.01); C08G 59/504 (2013.01); C08L 63/00 (2013.01); C08J 2363/00 (2013.01);
Abstract
A method for producing a fiber-reinforced composite material having high mechanical properties and high heat resistance, and allowing the use of a gypsum die in primary curing, wherein a fiber-reinforced prepreg, obtained by impregnating reinforcing fibers with an epoxy resin composition comprising a triphenylmethane-type epoxy resin, N,N,N',N′-tetraglycidyldiaminodiphenylmethane (B) and diaminodiphenylsulfone (C), is subjected to primary curing at 110-130° C., and then to secondary curing at a temperature which is at least as high as the primary curing temperature.