The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Mar. 22, 2011
Applicants:
Kei Kaneko, Odawara, JP;
Naomi Shida, Tokyo, JP;
Masahiro Yamamoto, Kawasaki, JP;
Yasushi Hattori, Kawasaki, JP;
Inventors:
Kei Kaneko, Odawara, JP;
Naomi Shida, Tokyo, JP;
Masahiro Yamamoto, Kawasaki, JP;
Yasushi Hattori, Kawasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); C09K 11/77 (2006.01); H05B 33/10 (2006.01); H05B 33/14 (2006.01); H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); C09K 11/7734 (2013.01); C09K 11/7774 (2013.01); H05B 33/10 (2013.01); H05B 33/14 (2013.01); H01L 33/20 (2010.10); H01L 33/502 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A method of manufacturing a light-emitting device includes disposing a light-emitting element on a supporting member, dispersing a fluorescent substance having a particle diameter of 20 to 45 μm in a material of the light-transmitting member at a concentration of 40 to 60 wt %, dripping raw material for the fluorescent layer on the light-emitting element while lowering the viscosity of the raw material, and thermally curing the coated layer.