The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Mar. 24, 2010
Applicants:

Tomomi Okamoto, Kawasaki, JP;

Hiroshi Yamada, Kawasaki, JP;

Ryuji Ito, Kawasaki, JP;

Osamu Higashi, Kawasaki, JP;

Inventors:

Tomomi Okamoto, Kawasaki, JP;

Hiroshi Yamada, Kawasaki, JP;

Ryuji Ito, Kawasaki, JP;

Osamu Higashi, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 17/00 (2006.01); G01K 1/00 (2006.01); G01K 7/00 (2006.01); G01K 13/00 (2006.01); G01K 1/14 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
G01K 1/14 (2013.01); H01L 23/34 (2013.01); H01L 2924/0002 (2013.01);
Abstract

There is provided a heat sink for measuring temperature of electronic component. The heat sink includes a heat radiating plate, a fin, a heat receiving plate, and a temperature detector. The heat radiating plate has a first surface that receives heat from the electronic component. The fin is for radiating heat energy conducting through the heat radiating plate and is connected to the heat radiating plate. The heat receiving plate arranged apart from the heat radiating plate has a second surface movable to be parallel to the first surface. The temperature detector that detects a temperature is disposed on the heat receiving plate.


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