The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Feb. 27, 2013
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Tamás Vásárhelyi, Budapest, HU;

József Fülöp, Budapest, HU;

Tímea Seszták, Budapest, HU;

Zsolt Bagoly, Budapest, HU;

Jácint Gergely, Budapest, HU;

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); F21K 99/00 (2010.01); F21V 23/00 (2006.01); H05K 1/00 (2006.01); H01R 12/51 (2011.01);
U.S. Cl.
CPC ...
F21K 9/90 (2013.01); F21V 23/004 (2013.01); H05K 1/00 (2013.01); H01R 12/515 (2013.01);
Abstract

A lamp includes a collar with internal and outer surfaces, where two or more connection pins extend from the internal surface of the collar. At least two connection pins have a head portion distal from the collar internal surface. The head portions include a slot. The lamp includes a light source with at least two external lead-in wires. The lead-in wires are located within respective slots and are mechanically coupled to respective surfaces of the slots in a press-fit manner which may be free of wrapping, winding, twisting, or soldering. A PCB disposed inside the lamp has two opposing surfaces and a rim between the two opposing surfaces. There are conductive surfaces disposed on at least one of the rim and one of the opposing surfaces at positions corresponding to connection pin slots. The PCB is located between connection pins with the conductive surfaces in electrical communication with the lead-in wires.


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