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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8973807 B1

PDFFull Text
Date of Patent:
Mar. 10, 2015

Filed:

Apr. 12, 2011

Bonding tool, electronic component mounting apparatus, and manufacturing method of bonding tool

Applicants:

Ryo Fujita, Hyogo, JP;

Hiroshi Ebihara, Osaka, JP;

Inventors:

Ryo Fujita, Hyogo, JP;

Hiroshi Ebihara, Osaka, JP;

Assignee:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Attorney:

RatnerPrestia

Primary Examiner:

Erin Saad

Int. Cl.
CPC ...
B23K 20/10 (2006.01); B23K 5/20 (2006.01); B23K 1/06 (2006.01); B29C 65/00 (2006.01); B29C 65/08 (2006.01); H01L 23/00 (2006.01); B23K 1/00 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/00 (2013.01); B29C 65/08 (2013.01); B29C 65/081 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/75303 (2013.01); H01L 2224/7531 (2013.01); H01L 2224/75355 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75801 (2013.01); H01L 2224/75821 (2013.01); H01L 2224/759 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/014 (2013.01); H05K 13/0408 (2013.01);
Abstract

In some cases, it is difficult to carry out ultrasonic joining of high quality with a conventional bonding tool. A bonding tool includes: a horn that transmits an ultrasonic vibration; an ultrasonic vibrator that is provided at one end of the horn, and generates the ultrasonic vibration; and an electronic component holding part that holds an electronic component, wherein the electronic component holding part has a male fitting part in a shape of a tapering-off, and an electronic component holding face that holds the electronic component on an opposite side to the male fitting part, a female fitting part in a shape according to a shape of the male fitting part is formed in a predetermined face of the horn, and the male fitting part is fitted into the female fitting part via an adhesion layer.

Find Patent Forward Citations

Fujita, Ryo. (2015). Bonding tool, electronic component mounting apparatus, and manufacturing method of bonding tool (U.S. Patent No. 8973807). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8973807

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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