The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Sep. 25, 2011
Applicant:
Cheng-hung Chiang, Keelung, TW;
Inventor:
Cheng-Hung Chiang, Keelung, TW;
Assignee:
Getac Technology Corporation, Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/22 (2006.01); H01Q 1/38 (2006.01); H01K 3/20 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01K 3/20 (2013.01);
Abstract
A manufacturing method of an object having a conductive line includes the following steps. A hardening layer and a conductive line layer are formed in an in-mold roller (IMR) material in sequence. The conductive line layer is formed on a non-conductive substrate by an IMR process. A carrier sheet is then separated to expose the hardening layer. A connecting piece is formed on the hardening layer. The connecting piece runs through the hardening layer by a connection process, and the connecting piece is electrically connected to the conductive line layer. Therefore, an object structure having the conductive line is formed.