The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Sep. 11, 2012
Yong Won Lee, Suwon-si, KR;
Tae Sang Park, Seoul, KR;
Hyo Young Shin, Yongin-si, KR;
Ji Young Jang, Incheon, KR;
Young Jun Moon, Hwaseong-si, KR;
Soon Min Hong, Seoul, KR;
Yong Won Lee, Suwon-si, KR;
Tae Sang Park, Seoul, KR;
Hyo Young Shin, Yongin-si, KR;
Ji Young Jang, Incheon, KR;
Young Jun Moon, Hwaseong-si, KR;
Soon Min Hong, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.