The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Dec. 25, 2008
Applicant:

Taras Kushta, Tokyo, JP;

Inventor:

Taras Kushta, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/203 (2006.01); H01P 7/08 (2006.01); H01P 1/205 (2006.01); H01P 7/04 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01P 1/2056 (2013.01); H01P 1/203 (2013.01); H01P 7/08 (2013.01); H01P 7/04 (2013.01); H05K 1/0251 (2013.01); H05K 1/0222 (2013.01); H05K 1/116 (2013.01); H05K 3/429 (2013.01); H05K 2201/09454 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09627 (2013.01); H05K 2201/09718 (2013.01);
Abstract

A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via.


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