The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Mar. 11, 2013
Applicants:
Takuya Shiraishi, Tokyo, JP;
Tomofumi Tanaka, Tokyo, JP;
Inventors:
Takuya Shiraishi, Tokyo, JP;
Tomofumi Tanaka, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 1/00 (2006.01); H01L 27/06 (2006.01); H03K 17/56 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0617 (2013.01); H03K 17/56 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); Y02B 70/1483 (2013.01);
Abstract
A power module includes an IGBT; a MOSFET connected in parallel with the IGBT; a lead frame having a first frame portion on which the IGBT is mounted and a second frame portion on which the MOSFET is mounted, and having a step by which the first frame portion is located at a first height and the second frame portion is located at a second height larger than the first height; and an insulation sheet for a heat sink which is disposed on an underside of only the first frame portion of the lead frame.