The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Dec. 30, 2011
Applicant:
Masahiro Inohara, Fujisawa, JP;
Inventor:
Masahiro Inohara, Fujisawa, JP;
Assignee:
Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 23/5226 (2013.01); H01L 23/66 (2013.01); H01L 2223/6627 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1903 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A higher aspect ratio for upper level metal interconnects is described for use in higher frequency circuits. Because the skin effect reduces the effective cross-sectional area of conductors at higher frequencies, various approaches are described to reduce the effective RC delay in interconnects.
Inohara, Masahiro. (2015). Interconnect structure for high frequency signal transmissions (U.S. Patent No. 8970048). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8970048
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