The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Mar. 06, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Stephen W. Bedell, Wappingers Falls, NY (US);

Norma E. Sosa Cortes, New York, NY (US);

Wilfried E. Haensch, Somers, NY (US);

Steven J. Koester, Edina, MN (US);

Devendra K. Sadana, Pleasantville, NY (US);

Katherine L. Saenger, Ossining, NY (US);

Ghavam Shahidi, Round Ridge, NY (US);

Davood Shahrjerdi, Ossining, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/053 (2014.01); H01L 27/142 (2014.01); H01L 31/02 (2006.01); H01L 31/0747 (2012.01); H01L 31/075 (2012.01); H01L 31/076 (2012.01); H01L 31/078 (2012.01); H01L 31/18 (2006.01); H01L 31/20 (2006.01);
U.S. Cl.
CPC ...
H01L 27/142 (2013.01); H01L 31/02008 (2013.01); H01L 31/0747 (2013.01); H01L 31/075 (2013.01); H01L 31/076 (2013.01); H01L 31/078 (2013.01); H01L 31/1804 (2013.01); H01L 31/202 (2013.01); Y02E 10/548 (2013.01); Y02E 10/547 (2013.01);
Abstract

An autonomous integrated circuit (IC) includes a solar cell formed on a bottom substrate of a silicon-on-insulator (SOI) substrate as a handle substrate; an insulating layer of the SOI substrate located on top of the solar cell; and a device layer formed on a top semiconductor layer of the SOI substrate located on top of the insulating layer, wherein a top contact of the device layer is electrically connected to a bottom contact of the solar cell such that the solar cell is enabled to power the device layer.


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