The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Feb. 21, 2012
Akinobu Kanai, Kyoto, JP;
Yoshitaka Adachi, Kyoto, JP;
Masao Shimizu, Shiga, JP;
Junichi Tanaka, Kyoto, JP;
Sho Sasaki, Kyoto, JP;
Akinobu Kanai, Kyoto, JP;
Yoshitaka Adachi, Kyoto, JP;
Masao Shimizu, Shiga, JP;
Junichi Tanaka, Kyoto, JP;
Sho Sasaki, Kyoto, JP;
OMRON Corporation, Kyoto, JP;
Abstract
A sensor package has a semiconductor sensor chip, and a package body that has a semiconductor sensor chip mounting region on which the semiconductor sensor chip is mounted. The package body being a resin injection molded product. A groove is formed in a rear surface on an opposite side to a surface, on which the semiconductor sensor chip is mounted, so as to surround the semiconductor sensor chip mounting region. A coupling section is formed in the rear surface to couple a resin portion inside the groove and a resin portion outside the groove.