The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Dec. 15, 2009
Applicants:

Takehiko Okabe, Chiba, JP;

Daisuke Hiraiwa, Ichihara, JP;

Remi Ohba, Ichihara, JP;

Inventors:

Takehiko Okabe, Chiba, JP;

Daisuke Hiraiwa, Ichihara, JP;

Remi Ohba, Ichihara, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/40 (2010.01); H01L 33/32 (2010.01); H01L 33/42 (2010.01);
U.S. Cl.
CPC ...
H01L 33/405 (2013.01); H01L 33/32 (2013.01); H01L 33/42 (2013.01);
Abstract

A semiconductor light-emitting device () of the present invention includes: a substrate (); a laminated semiconductor layer () containing a light-emitting layer, which is formed on the substrate (); a first electrode () formed on the upper surface () of the laminated semiconductor layer (); and a second electrode () formed on an exposed surface () that is formed by partially cutting the laminated semiconductor layer (), wherein the first electrode () includes a transparent electrode () containing a hole portion () through which the upper surface () of the laminated semiconductor layer () is exposed, a junction layer () formed on a bottom surface () and an inner wall () of the hole portion (), and a bonding pad electrode () formed to cover the junction layer ().


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