The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Sep. 09, 2013
Applicant:

Total Petrochemicals Research Feluy, Seneffe, BE;

Inventors:

Alain Standaert, Brussels, BE;

Romain Luijkx, Chercq, BE;

Martine Slawinski, Nivelles, BE;

Aurelien Vantomme, Bois-de-Villers, BE;

Assignee:

Total Research & Technology Feluy, Seneffe (Feluy), BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 4/6592 (2006.01); C08F 210/02 (2006.01); C08L 23/08 (2006.01); C08F 4/76 (2006.01); C08F 210/16 (2006.01); C08L 23/06 (2006.01); C08F 4/659 (2006.01); C08F 110/02 (2006.01);
U.S. Cl.
CPC ...
C08F 4/76 (2013.01); C08F 210/16 (2013.01); C08L 23/06 (2013.01); C08F 4/65908 (2013.01); C08F 4/65912 (2013.01); C08F 4/65927 (2013.01); C08L 23/0815 (2013.01); C08L 2203/10 (2013.01); C08L 2205/02 (2013.01); C08L 2205/025 (2013.01); C08L 2314/06 (2013.01); C08F 110/02 (2013.01); Y10S 526/943 (2013.01);
Abstract

This invention discloses caps and closures produced by injection molding with a bimodal high density polyethylene (HDPE) resin comprising a low molecular weight, high density polyethylene fraction substantially free of comonomer and a high molecular weight, low density polyethylene fraction, having a molecular weight distribution of at least 3.5, preferably greater than 4.0, prepared in two reactors connected in series in the presence of a metallocene-containing catalyst system, wherein the metallocene comprises a bisindenyl or a bis-tetrahydrogenated-indenyl component.


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