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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8969490 B1

PDFFull Text
Date of Patent:
Mar. 03, 2015

Filed:

Mar. 24, 2009

Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device

Applicants:

Noriyuki Ohigashi, Tokyo, JP;

Michio Kimura, Tokyo, JP;

Haruo Murakami, Tokyo, JP;

Inventors:

Noriyuki Ohigashi, Tokyo, JP;

Michio Kimura, Tokyo, JP;

Haruo Murakami, Tokyo, JP;

Assignee:

Sumitomo Bakelite Company, Ltd., Tokyo, JP;

Attorney:

Ditthavong & Steiner, P.C.

Primary Examiner:

Jennifer Chriss

Assistant Examiner:

Camie Thompson

Int. Cl.
CPC ...
B32B 17/10 (2006.01); B29C 65/00 (2006.01); C08F 283/00 (2006.01); H05K 7/00 (2006.01); H05K 1/03 (2006.01); C08G 59/32 (2006.01); C08G 59/50 (2006.01); C08J 5/18 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08L 71/00 (2006.01); C08K 3/00 (2006.01); C08K 5/3445 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0326 (2013.01); C08G 59/3218 (2013.01); C08G 59/5073 (2013.01); C08G 2650/56 (2013.01); C08J 5/18 (2013.01); C08J 5/24 (2013.01); C08J 2363/00 (2013.01); C08K 3/0033 (2013.01); C08K 5/3445 (2013.01); C08L 63/00 (2013.01); C08L 71/00 (2013.01); H05K 3/4626 (2013.01);
Abstract

An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device. These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.

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