The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
May. 27, 2014
Dsm Ip Assets B.v., Heerlen, NL;
Pieter Gijsman, Beek, NL;
Wilhelmus J. M. Sour, Maastricht, NL;
Rudy Rulkens, Cadier en Keer, NL;
Robert H. C. Janssen, Elsloo, NL;
DSM IP Assets B.V., Heerlen, NL;
Abstract
A thermostabilized thermoplastic molding composition includes a) a thermoplastic polyamide composition which consists of a blend of at least two polyamides. The at least two polyamides include a1) at least 50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1) selected from the group consisting of polyamide-4,6, polyamide-6,6 and semi-aromatic polyamides and mixtures thereof; and a2) an amount of 1-50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a second polyamide (PA-2) selected from the group consisting of polyamide-6 and copolymers thereof. The composition also contains b) 0.001-3 mass %, relative to the total mass of the thermoplastic polyamide composition, of a copper salt; and c) 0.01-10 mass %, relative to the total mass of the thermoplastic polyamide composition, of iron oxide. The molding composition exhibits reduced deterioration when exposed to an elevated temperature of 230° C. for a prolonged time period of 1000 hours as compared to an identical molding composition including a Cul/KI stabilization system but not including the iron oxide.