The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Dec. 14, 2012
Applicant:
Imra America, Inc., Ann Arbor, MI (US);
Inventors:
Assignee:
IMRA America, Inc., Ann Arbor, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/268 (2006.01); B23K 26/00 (2014.01); H01L 21/78 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/2686 (2013.01); B23K 26/0048 (2013.01); B23K 26/0057 (2013.01); H01L 21/78 (2013.01); H01L 33/0095 (2013.01); Y10S 438/94 (2013.01);
Abstract
Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.