The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Dec. 03, 2010
Applicants:
Ward G. Fillmore, Hudson, MA (US);
William J. Davis, Hollis, NH (US);
Inventors:
Ward G. Fillmore, Hudson, MA (US);
William J. Davis, Hollis, NH (US);
Assignee:
Raytheon Company, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/00 (2006.01); B81C 1/00 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00301 (2013.01); H01L 23/544 (2013.01); H01L 21/6835 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54426 (2013.01); H01L 2924/00013 (2013.01); B81B 2207/092 (2013.01); B81B 2207/095 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A package for a plurality of semiconductor devices having: an electrical interconnect structure, comprising: an electrical interconnect structure; and an active device structure, comprising the plurality of semiconductor devices on an active device substrate. The electrical interconnect structure is bonded to the active device structure and the electrical interconnect structure provides electrical interconnection among the semiconductor devices.