The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Jun. 14, 2013
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01);
Abstract
A method of fabricating an electronic component includes: mounting a device chip on an upper surface of an insulative substrate; forming a sealing portion that seals the device chip; cutting the insulative substrate and the sealing portion; and forming a plated layer covering the sealing portion by barrel plating.