The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Dec. 17, 2012
Intersil Americas Llc, Milpitas, CA (US);
Randolph Cruz, West Melbourne, FL (US);
Loyde M. Carpenter, Jr., Palm Bay, FL (US);
Intersil Americas LLC, Milpitas, CA (US);
Abstract
Embodiments described herein relate to a method of manufacturing a packaged circuit having a solder flow-impeding plug on a lead frame. The method includes partially etching an internal surface of a lead frame at dividing lines between future sections of the lead frame as first partial etch forming a trench. A non-conductive material that is adhesive to the lead frame is applied in the trench, such that the non-conductive material extends across the trench to form the solder flow-impeding plug. One or more components are attached to the internal surface of the lead frame and encapsulated. An external surface of the lead frame is etched at the dividing lines to disconnect different sections of lead frame as a second partial etch.