The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Sep. 20, 2011
Applicants:
David William Sherrer, Radford, VA (US);
James Macdonald, Chandler, AZ (US);
Inventors:
David William Sherrer, Radford, VA (US);
James MacDonald, Chandler, AZ (US);
Assignee:
Nuvotronics, LLC, Radford, VA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/047 (2006.01); C23C 24/08 (2006.01); C23C 28/04 (2006.01); C23C 28/00 (2006.01); H01L 23/06 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01); H01Q 17/00 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/047 (2013.01); C23C 24/082 (2013.01); C23C 28/042 (2013.01); C23C 28/42 (2013.01); H01L 23/06 (2013.01); H01L 23/24 (2013.01); H01L 23/564 (2013.01); H01Q 17/00 (2013.01); H01Q 23/00 (2013.01); H01L 2924/09701 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49109 (2013.01);
Abstract
Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.