The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Sep. 23, 2010
Applicants:

Lidong Chen, Shanghai, CN;

Xihong Chen, Shanghai, CN;

Lin He, Horseheads, NY (US);

Xiangyang Huang, Shanghai, CN;

Zhen Xiong, Shanghai, CN;

Wenqing Zhang, Shanghai, CN;

Inventors:

Lidong Chen, Shanghai, CN;

Xihong Chen, Shanghai, CN;

Lin He, Horseheads, NY (US);

Xiangyang Huang, Shanghai, CN;

Zhen Xiong, Shanghai, CN;

Wenqing Zhang, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01G 51/00 (2006.01); H01L 35/18 (2006.01); H01L 35/20 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
C01G 51/006 (2013.01); H01L 35/20 (2013.01); B82Y 30/00 (2013.01); C01P 2002/52 (2013.01); C01P 2002/72 (2013.01); C01P 2004/64 (2013.01); C01P 2004/80 (2013.01); C01P 2006/40 (2013.01); H01L 35/18 (2013.01); Y10S 977/779 (2013.01); Y10S 977/784 (2013.01);
Abstract

A composite material comprises a filled skutterudite matrix of formula (I) ICoSbin which (I) represents at least one of Yb, Eu, Ce, La, Nd, Ba and Sr, 0.05≦y<1; and GaSb particles within the filled skutterudite matrix, wherein the composite material comprises 0.05-5 mol % GaSb particles. Compared with conventional materials, the composite material exhibits a substantially increased Seebeck coefficient, a slightly decreased overall thermal conductivity, and a substantially increased thermoelectric performance index across the whole temperature zone from the low temperature end to the high temperature end, as well as a greatly enhanced thermoelectric efficiency.


Find Patent Forward Citations

Loading…