The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Jul. 29, 2013
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Jun Yamamuro, Yokohama, JP;

Yoshinori Tagawa, Yokohama, JP;

Satoshi Ibe, Yokohama, JP;

Hiroto Komiyama, Tokyo, JP;

Kouji Hasegawa, Kawasaki, JP;

Shiro Sujaku, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 15/00 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1626 (2013.01); B41J 2/1603 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1634 (2013.01); B41J 2/1639 (2013.01); B41J 2/1645 (2013.01);
Abstract

A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.


Find Patent Forward Citations

Loading…