The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Apr. 26, 2011
Applicants:

Yoji Urano, Osaka, JP;

Ryoji Yokotani, Osaka, JP;

Ikko Kuzuhara, Niigata, JP;

Kenichiro Tanaka, Osaka, JP;

Inventors:

Yoji Urano, Osaka, JP;

Ryoji Yokotani, Osaka, JP;

Ikko Kuzuhara, Niigata, JP;

Kenichiro Tanaka, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21S 4/00 (2006.01); F21V 21/00 (2006.01); H05K 1/02 (2006.01); F21K 99/00 (2010.01); F21V 19/00 (2006.01); H05K 1/18 (2006.01); F21V 29/00 (2006.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H05K 1/05 (2006.01); H05K 3/20 (2006.01); F21Y 101/02 (2006.01); F21Y 103/00 (2006.01); F21Y 105/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); F21K 9/17 (2013.01); F21K 9/30 (2013.01); F21K 9/90 (2013.01); F21V 19/004 (2013.01); H05K 1/181 (2013.01); F21V 29/2256 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H05K 1/0271 (2013.01); H05K 1/056 (2013.01); H05K 3/202 (2013.01); F21Y 2101/02 (2013.01); F21Y 2103/003 (2013.01); F21Y 2105/001 (2013.01); H05K 2201/10106 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/49113 (2013.01); H01L 24/45 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/12041 (2013.01); Y10S 362/80 (2013.01);
Abstract

Provided is lead frame in which a wiring pattern supported by a support piece inside of a one-pitch outer frame section comprises a plurality of base units, each of which comprises a die pad on which a solid-state light emitting element is mounted, a heat sink extending from die pad so as to surround die pad electrically connected to one electrode of the element, and a lead electrically connected to the other electrode of the element. Lead of one base unit among adjacent base units and heat sink of the other base unit are coupled and electrically connected in series. Increase in temperature of the element is inhibited, light output is increased, and cost of a light emitting unit in which a plurality of solid-state light emitting elements connected in series are used is reduced. Also provided are wiring board, light emitting unit, and illuminating apparatus.


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