The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Mar. 21, 2012
Khiet Le, Mission Viejo, CA (US);
Vicentiu Grosu, San Pedro, CA (US);
Gregory S. Smith, Woodland Hills, CA (US);
Yunqi Zheng, Racho Palos Verdes, CA (US);
Gregory D. Rosdahl, Dominguez Hills, CA (US);
Khiet Le, Mission Viejo, CA (US);
Vicentiu Grosu, San Pedro, CA (US);
Gregory S. Smith, Woodland Hills, CA (US);
Yunqi Zheng, Racho Palos Verdes, CA (US);
Gregory D. Rosdahl, Dominguez Hills, CA (US);
GM Global Technology Operations LLC, Detroit, MI (US);
Abstract
Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.