The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Jul. 27, 2009
Applicant:
Bong Young Kim, Suwon-si, KR;
Inventor:
Bong Young Kim, Suwon-si, KR;
Assignee:
Samsung SDI Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/6835 (2013.01); H01L 24/48 (2013.01); H05K 3/007 (2013.01); H01L 24/28 (2013.01); H01L 24/45 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29198 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/484 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/85001 (2013.01); H01L 2224/85444 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H05K 3/0052 (2013.01); H05K 3/284 (2013.01); H05K 3/305 (2013.01); H05K 2203/016 (2013.01); H05K 2203/049 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/293 (2013.01); H01L 2924/01015 (2013.01);
Abstract
A manufacturing method for a protection circuit module of a secondary battery is disclosed. The method includes mounting a die type circuit device to an FPCB. The mounting of the circuit device includes bonding the circuit device to the FPCB by wire bonding. The method may further include forming a protective layer on the FPCB to cover the circuit device. The protective layer may be formed by coating insulation resin on the FPCB.
Kim, Bong. (2015). Manufacturing method for protection circuit module of secondary battery (U.S. Patent No. 8966749). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8966749
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile