The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Mar. 03, 2011
Applicants:

Hironobu Kazama, Matsumoto, JP;

Takahiro Kamijo, Matsumoto, JP;

Masato Shimada, Chino, JP;

Hiroyuki Kamei, Azumino, JP;

Yuka Yonekura, Chino, JP;

Motoki Takabe, Shiojiri, JP;

Inventors:

Hironobu Kazama, Matsumoto, JP;

Takahiro Kamijo, Matsumoto, JP;

Masato Shimada, Chino, JP;

Hiroyuki Kamei, Azumino, JP;

Yuka Yonekura, Chino, JP;

Motoki Takabe, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); H01L 41/09 (2006.01); H01L 41/187 (2006.01); H01L 41/318 (2013.01); H01L 41/314 (2013.01); C23C 16/52 (2006.01); H01L 21/3213 (2006.01); H01L 21/3065 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1646 (2013.01); B41J 2/1623 (2013.01); B41J 2/161 (2013.01); B41J 2/1626 (2013.01); B41J 2/1632 (2013.01); B41J 2/1635 (2013.01); H01L 41/0973 (2013.01); H01L 41/1876 (2013.01); H01L 41/318 (2013.01); H01L 41/314 (2013.01); C23C 16/52 (2013.01); H01L 21/32136 (2013.01); H01L 21/3065 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14419 (2013.01);
Abstract

In sputter etching to improve the adhesion between upper electrodes and lead electrodes, the sputter etching of surfaces of the upper electrodes under an Ar gas flow at a flow rate of 60 sccm or more can reduce the residence time of Ar ions on the surfaces of the upper electrodes because of the Ar gas flow. This can prevent the charging of the upper electrodes due to the buildup of ionized Ar gas on the surfaces, reduce the influence of charging on piezoelectric elements, and provide a method for manufacturing a piezoelectric actuator that includes the piezoelectric elements each including a piezoelectric layer having small variations in hysteresis characteristics and deformation characteristics.


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