The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Mar. 15, 2013
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventor:

Akiyoshi Saitou, Oota, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 27/02 (2006.01); H01L 21/48 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5072 (2013.01); H01L 27/02 (2013.01); H01L 27/0207 (2013.01); H01L 21/4853 (2013.01); H01L 23/50 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A design support method includes: selecting, by a computer, a power feed point of an integrated semiconductor circuit on a first board model in which a power supply layer and a ground layer are stacked; determining a first placement position of a first protrusion portion from the first board model on a side of the first board model, the first protrusion portion being corresponding to the power feed point; determining a second placement position of a second protrusion portion from the first board model on the side of the first board model, the second protrusion portion provided so as to separate from the first placement position by a distance; and placing the first protrusion portion and the second protrusion portion on the first placement position and the second placement position, respectively.


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