The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Aug. 29, 2012
Applicants:

Yoshihiro Yoneda, Yokohama, JP;

Masaki Yanagisawa, Yokohama, JP;

Kenji Koyama, Yokohama, JP;

Hirohiko Kobayashi, Yokohama, JP;

Kenji Hiratsuka, Yokohama, JP;

Inventors:

Yoshihiro Yoneda, Yokohama, JP;

Masaki Yanagisawa, Yokohama, JP;

Kenji Koyama, Yokohama, JP;

Hirohiko Kobayashi, Yokohama, JP;

Kenji Hiratsuka, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/06 (2006.01); H01S 5/227 (2006.01); H01S 5/042 (2006.01); H01S 5/0625 (2006.01); H01S 5/343 (2006.01); H01S 5/20 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02461 (2013.01); H01S 5/0261 (2013.01); H01S 5/0612 (2013.01); H01S 5/2275 (2013.01); H01S 5/0425 (2013.01); H01S 5/06256 (2013.01); H01S 5/3434 (2013.01); H01S 5/209 (2013.01);
Abstract

A semiconductor optical integrated device includes a substrate having a main surface with a first and second regions arranged along a waveguiding direction; a gain region including a first cladding layer, an active layer, and a second cladding layer arranged on the first region of the main surface; and a wavelength control region including a third cladding layer, an optical waveguide layer, and a fourth cladding layer arranged on the second region of the main surface and including a heater arranged along the optical waveguide layer. The substrate includes a through hole extending from a back surface of the substrate in the thickness direction and reaching the first region. A metal member is arranged in the through hole. The metal member extends from the back surface of the substrate in the thickness direction and is in contact with the first cladding layer.


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