The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Nov. 11, 2011
Applicant:
Seigo Ueno, Iwakura, JP;
Inventor:
Seigo Ueno, Iwakura, JP;
Assignee:
NGK Spark Plug Co., Ltd., Nagoya, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 23/49833 (2013.01); H05K 1/0231 (2013.01); H05K 1/162 (2013.01); H05K 1/181 (2013.01); H05K 3/4614 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/2018 (2013.01); H01L 2224/16225 (2013.01);
Abstract
There is provided a wiring board including a multilayer substrate and a reinforcing member. The multilayer substrate has a first main substrate surface formed with a chip mounting area to which an electronic chip is mounted and a second main substrate surface opposed to the first main substrate surface. The reinforcing member is fixed to either an area of the first main substrate surface other than the chip mounting area or the second main substrate surface and has a body predominantly formed of ceramic material and incorporating therein at least one capacitor.