The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Dec. 20, 2011
Applicants:

Teru Nakanishi, Kawasaki, JP;

Nobuyuki Hayashi, Kawasaki, JP;

Masaru Morita, Kawasaki, JP;

Yasuhiro Yoneda, Kawasaki, JP;

Inventors:

Teru Nakanishi, Kawasaki, JP;

Nobuyuki Hayashi, Kawasaki, JP;

Masaru Morita, Kawasaki, JP;

Yasuhiro Yoneda, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H05K 3/3436 (2013.01); H01L 2924/09701 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10992 (2013.01); H01L 23/49816 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/16 (2013.01);
Abstract

An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.


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