The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Jul. 10, 2012
Applicants:

Tzu Cheng Lin, New Taipei, TW;

Wei Cheng Chou, New Taipei, TW;

Inventors:

Tzu Cheng Lin, New Taipei, TW;

Wei Cheng Chou, New Taipei, TW;

Assignee:

Moxa Inc., New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01);
Abstract

A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically. Therefore, the structure achieves the goal of keeping the operating temperature of each electronic component in the corresponding environment.


Find Patent Forward Citations

Lin, Tzu. (2015). Heating and heat dissipating multi-layer circuit board structure for keeping operating temperature of electronic components (U.S. Patent No. 8964394). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8964394

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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