The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Jun. 21, 2012
Hiroaki Asano, Kariya, JP;
Yasuhiro Koike, Kariya, JP;
Kiminori Ozaki, Kariya, JP;
Hitoshi Shimadu, Kariya, JP;
Tetsuya Furuta, Kariya, JP;
Masao Miyake, Kariya, JP;
Takahiro Hayakawa, Ogaki, JP;
Tomoaki Asai, Nagoya, JP;
Ryou Yamauchi, Hashima, JP;
Hiroaki Asano, Kariya, JP;
Yasuhiro Koike, Kariya, JP;
Kiminori Ozaki, Kariya, JP;
Hitoshi Shimadu, Kariya, JP;
Tetsuya Furuta, Kariya, JP;
Masao Miyake, Kariya, JP;
Takahiro Hayakawa, Ogaki, JP;
Tomoaki Asai, Nagoya, JP;
Ryou Yamauchi, Hashima, JP;
Kabushiki Kaisha Toyota Jidoshokki, Aichi-Ken, JP;
Abstract
This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.