The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Mar. 18, 2013
Applicant:
Olympus Corporation, Tokyo, JP;
Inventors:
Haruhisa Saito, Tokyo, JP;
Yoshitaka Tadaki, Hanno, JP;
Assignee:
Olympus Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/02002 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54493 (2013.01);
Abstract
A semiconductor wafer may include: a disk-shaped wafer body made of silicon; and an identification trench section having at least one trench and provided at a periphery section of the wafer body, wherein the trench is opened in the periphery of the wafer body, and has a depth less than a thickness of the wafer body.