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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8963327 B1

PDFFull Text
Date of Patent:
Feb. 24, 2015

Filed:

Apr. 26, 2013

Semiconductor device including wiring board with semiconductor chip

Applicant:

Renesas Electronics Corporation, Kawasaki, Kanagawa, JP;

Inventors:

Kozo Harada, Kawasaki, JP;

Shinji Baba, Kawasaki, JP;

Masaki Watanabe, Kawasaki, JP;

Satoshi Yamada, Kawasaki, JP;

Assignee:

Renesas Electronics Corporation, Kanagawa, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Alexander Oscar Williams

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 21/563 (2013.01); H01L 24/14 (2013.01); H01L 23/3677 (2013.01); H01L 23/50 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/14152 (2013.01); H01L 2224/14154 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor device includes lands having an NSMD (non-solder mask defined) structure for mounting thereon solder balls placed in an inner area of a chip mounting area. The lands for mounting thereon solder balls are placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view. The semiconductor device is mounted on a mounting substrate with the balls.

Find Patent Forward Citations

Harada, Kozo. (2015). Semiconductor device including wiring board with semiconductor chip (U.S. Patent No. 8963327). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8963327

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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