The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Mar. 26, 2014
Applicants:

Takato Sato, Toyota, JP;

Yukio Onishi, Nagoya, JP;

Hiroyuki Kono, Nagoya, JP;

Hiroaki Yoshizawa, Toyota, JP;

Toshio Watari, Toyota, JP;

Hiromi Yamasaki, Toyota, JP;

Inventors:

Takato Sato, Toyota, JP;

Yukio Onishi, Nagoya, JP;

Hiroyuki Kono, Nagoya, JP;

Hiroaki Yoshizawa, Toyota, JP;

Toshio Watari, Toyota, JP;

Hiromi Yamasaki, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/40 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/40 (2013.01); H01L 23/3672 (2013.01);
Abstract

In a semiconductor device, a semiconductor module is pressed against a cooler by a spring member. The spring member is compressed by a beam member that is connected with a strut fixed to the cooler. The cooler has a pressed part in which the semiconductor module is pressed, and a strut fixing part to which the strut is fixed. The strut fixing part has higher rigidity than the pressed part.


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