The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Oct. 30, 2013
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Donald C. Abbott, Norton, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/64 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/4821 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 21/64 (2013.01); H01L 23/49575 (2013.01); H01L 23/49565 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device includes a leadframe, a semiconductor chip, a packaging compound. The leadframe has a pad with straps. Leads on the leadframe include first and second portions. The pad, the straps, and the leads have a mechanically rough surface. The semiconductor chip is attached to the pad and wire bonded to the first lead portions. A packaging compound encapsulates the chip, the pad, the straps, the bonding wires and the first lead portions. The second lead portions are left un-encapsulated. The strap ends are exposed on the surface of the package. At least one of the straps includes a portion adjacent to the exposed end. This portion having a mechanically smooth surface transitioning by a step into the rough surface of the remainder of the strap.


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