The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Jan. 22, 2014
Applicant:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Inventor:
Eun Jung Seo, Ansan-si, KR;
Assignee:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 23/495 (2006.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/8592 (2013.01);
Abstract
Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.