The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Oct. 25, 2006
Applicant:
BO Geun Park, Gwangju, KR;
Inventor:
Bo Geun Park, Gwangju, KR;
Assignee:
LG Innotek Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/54 (2010.01); B29C 39/02 (2006.01); B29C 39/10 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); B29C 39/025 (2013.01); B29C 39/026 (2013.01); B29C 39/10 (2013.01); B29L 2011/00 (2013.01); H01L 2224/48091 (2013.01);
Abstract
A light emitting diode (LED) package is provided. The LED package includes a printed circuit board (PCB), an electrode pad, an LED, a wire, and first and second moldings. The electrode pad and the LED are formed on the PCB. The wire electrically connects the LED with the electrode pad. The first molding is formed on the LED and the second molding is formed on the first molding.
Park, Bo. (2015). Light emitting diode package and method of manufacturing the same (U.S. Patent No. 8963188). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8963188
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile