The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Oct. 30, 2009
Hideki Yokota, Takasaki, JP;
Masashi Miyazaki, Takasaki, JP;
Hideki Yokota, Takasaki, JP;
Masashi Miyazaki, Takasaki, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
Disclosed is a printed wiring board offering improved reliability through increased mechanical strength at the bottom of cavity areas for mounting components. A printed wiring boardis characterized in that an insulation layeris formed on either the top or bottom side of a metal core, while an openingformed in the metal coreis used as a cavity areafor mounting a component, wherein a reinforcement patternis formed on the surface of an insulation layer facing the bottom of the cavity areain the insulation layer. The reinforcement patternis made of the same material as the wiring patternsformed on the insulation layer, and also formed simultaneously with these wiring patterns