The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Dec. 17, 2010
Applicants:

Ivan Sinicco, Pfaffikon, CH;

Andreas Huegli, Seewis, CH;

Jurgen Josef Dillmann, Kressbronn, DE;

Inventors:

Ivan Sinicco, Pfaffikon, CH;

Andreas Huegli, Seewis, CH;

Jurgen Josef Dillmann, Kressbronn, DE;

Assignee:

Tel Solar AG, Trubbach, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02N 6/00 (2006.01); H01L 31/042 (2014.01); F24J 2/52 (2006.01); H01L 31/048 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0422 (2013.01); F24J 2/5254 (2013.01); H01L 31/0482 (2013.01); F24J 2002/5298 (2013.01); Y02B 10/12 (2013.01); Y02B 10/20 (2013.01); Y02E 10/50 (2013.01); Y02E 10/47 (2013.01);
Abstract

The invention relates to a mounting interface configured for a photovoltaic module () comprising a backside () having an overall backside surface size (), the mounting interface comprising at least six mounting elements () attachable to the backside () of the photovoltaic module () for mounting the photovoltaic module () on a mounting surface, wherein each mounting element () comprises a mounting element surface having an overall mounting element surface size () such that the contact area between the photovoltaic module () and the mounting element (), when attached to the photovoltaic module (), equals the overall mounting element surface size (), and the overall backside surface size () of the photovoltaic module () divided by the summarized overall mounting element surface size () of all mounting elements () is ≧40 and ≦160, preferably ≧50 and ≦80, more preferably 52. The invention provides for reducing the size of each mounting element () such that the overall amount of material required for the mounting is reduced, resulting in minimized material costs.


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