The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Jan. 25, 2005
Applicants:

Hirokazu Arai, Osaka, JP;

Keiji Asai, Nobeoka, JP;

Inventors:

Hirokazu Arai, Osaka, JP;

Keiji Asai, Nobeoka, JP;

Assignee:

JTEKT Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 7/18 (2006.01); C08K 7/14 (2006.01); C08L 61/06 (2006.01); C08L 9/02 (2006.01); C08L 21/00 (2006.01); C08L 35/04 (2006.01); F16H 55/48 (2006.01);
U.S. Cl.
CPC ...
C08L 61/06 (2013.01); C08L 9/02 (2013.01); C08L 21/00 (2013.01); C08L 35/04 (2013.01); F16H 55/48 (2013.01);
Abstract

Disclosed is a phenol resin molding material comprising 100 parts by weight of a resol type phenol resin, 40 to 100 parts by weight of an inorganic fiber, 30 to 90 parts by weight of a natural silica powder having an average particle size of 0.5 to 15 μm and subjected to a coupling agent treatment and 1 to 15 parts by weight of a rubber component as main components. The molding material can contain 50% by weight or more of a glass fiber and a natural silica powder having a crushed shape can be used as the natural silica powder. As a molded article produced from the resin molding material, a resin pulley is exemplified.


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