The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Jun. 15, 2012
Applicants:

Arthur Joseph Fontenot, Iii, Baton Rouge, LA (US);

Wasif Khan, Baton Rouge, LA (US);

John Wesley Summers, Ii, Perry, OH (US);

Inventors:

Arthur Joseph Fontenot, III, Baton Rouge, LA (US);

Wasif Khan, Baton Rouge, LA (US);

John Wesley Summers, II, Perry, OH (US);

Assignee:

Lion Copolymer Geismar, LLC, Geismar, LA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/15 (2006.01); C08L 23/16 (2006.01); C09D 123/16 (2006.01); C08K 5/1515 (2006.01); C08K 3/20 (2006.01);
U.S. Cl.
CPC ...
C08L 23/16 (2013.01); C09D 123/16 (2013.01); C08K 5/1515 (2013.01); C08L 2205/02 (2013.01); C08K 3/20 (2013.01);
Abstract

A solvent-less liquid ethylene propylene diene rubber compound and a solvent-less liquid ethylene propylene rubber compound are provided. The compounds can include a liquid ethylene propylene diene or a liquid ethylene propylene mixed with a filler system, a plasticizer, and a cross-linking agent to form the compound. The compound can have a viscosity ranging from 150,000 centipoises to 750,000 centipoises at a temperature of 23 degrees Celsius, allowing the compound to be liquid injection moldable. The compound can contain substantially no solvent.


Find Patent Forward Citations

Loading…